Printed circuit board finishes
All surface finish methods have their pros and cons; the decisive factor is, of course, their application. A short overview of the most common surface finishes is given below. Please contact us if you have any questions about this.
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SURFACE FINISH METALS
All surface finish methods have their pros and cons; the decisive factor is, of course, their application. A short overview of the most common surface finishes is given below. Please contact us if you have any questions about this.
(HASL) Tin/Lead hot air solder level + Excellent solderability + Inexpensive + Allows large process windows + Tried and tested surface finish + Shelf life – min. 12 months - Not completely flat soldering surfaces - Non-RoHS-compatible surface finish
(HASL) Lead-free hot air solder level + Excellent solderability + Tried and tested surface finish + Relatively inexpensive + Allows large process windows + Shelf life – min. 12 months - Not completely flat soldering surfaces (but more flat than leaded HASL) Recommended as a replacement for leaded HASL. Should also be regarded as an alternative to other lead-free surface finishes due to its relative flatness.
Immersion Tin + Excellent flatness + Good solderability + Relatively inexpensive - Sensitive to handling - Shelf life – up to 6 months - Coating depth is important, placing high demands on process control Sometimes recommended as a replacement for ENIG, primarily for BGA assembly.
ENIG (Electroless Nickel & Immersion Gold) + Good solderability + Tried and tested process + Excellent flatness + Shelf life 12 months - Expensive - Black pad problems – (oxidation of nickel below the gold layer) - Coating depth is important, placing high demands on process control