AGS offers simple to complex PCB and PCBA design with most software platforms. Behind us there is a professional PCB design team, which has over 5 years of extensive experience in the hardware, layout and emulation. PCB design rules, EMC design and SL, PL emulation working experience are combined in the high-speed PCB design. Besides that the PCB designers have abundant design experience in industrial-control, security-defence and communication etc and they are familiar with PCB\SMT manufacturing technology.
PCB design adopts advanced DFX and signal integrity design, which insure the reliability and the convenience in later period of hardware debugging, and offer reliable design service for customers.
PCB Layout DesignWe provide products which are used in security defense, data communication, medical treatment, industrial autoimmunization layout design, including high-speed\high-frequency PCBs, complex high-speed PCBs, blinded and buried PCBs, modulus mixed PCBs' design. And we can complete a schematic diagram design under the demand of customer.
Components EncapsulationBuild PCB capsulation base as per customer's components datasheet or components practicality, and obey the IPC designation standard.
Signal Integrality DesignAnalysis and diagnosis will be done to customers' schematic diagram or pre-research program. Professional evaluation will be done to signal quality issue, such as reflections, overshoot, ringing, crosstalk etc, which might appear in single board or backplane.
Then submit reasonable recommendation or scheme, choose topology structure, determine the device type, and submit signal integrity simulation analysis report.
EMC Design and RevisionAccording to customers' test level requirement, EMC design scheme will be provided for new design, and single board revising countermeasure will be provided for old design, which to meet the test requirement.
PCB Design Capacity
Hardware design and PCB design based on core processor, such as SCM, DSP, FPGA, ARM, POWERPC, MIPS, X86.
High-speed/high-frequency PCB, complex multi-layer high-speed PCB, blinded and buried PCB, impedance control PCB design.
Build PCB encapsulation base as per customer's components Datasheet or components, and obey the IPC designation standard.
- Layers count: 1-30
- The min. traces width/gaps: 3.5/3.5mil
- The min. hole diameter: 0.1mm
- The max amount of BGA:30
- The mim. pitch in BGA: 0.4mm
- FPC design: 20-layer rigid-flex PCB.
- DFX design: DFM, DFA, DFT ,DFC.
- Some other special design as per customers' requirement.