PCB Capabilities
You can see here our General manufacturing capability for single, double sided and multilayer printed circuit boards. Where tighter tolerances are required from your side, please contact us, and we will for sure find a good solution for your requirement.
Phone: CHINA - CARL: +86 136 99888802, US - RON: 256 883 4400
Email: US: sales@agssales.com, China: sales@ags-china.com
Email: US: sales@agssales.com, China: sales@ags-china.com
Technical Capabilities
You can see here our General manufacturing capability for single, double sided and multilayer printed circuit boards. Where tighter tolerances are required from your side, please contact us, and we will for sure find a good solution for your requirement.All AGS’s manufacturers are UL, ISO9002, QS9000, and ISO14000 approved. AGS also has TS16949 certified suppliers. All AGS’s products are ROHS
PRINTED CIRCUIT BOARD CAPABILITIES
| A. BOARD / LAMINATION B. BASIC MATERIAL C. DRILLING D. DRY FILM E. PLATING |
F. ETCHING G. SOLDERMASK H. LEGEND I. CARBON INK J. 2ND DRILL |
K. ROUTING L. PUNCHING M. V-CUT N. CHAMFER O. OTHER |
| PROCESS | DATA | |
| A. BOARD / LAMINATION |
Multi-layer alignment precision Minimum laminated Board thickness Special: Board dimension max: Special - up to: |
± 0.050mm 0.200 mm 0.075 mm 490 x 590 mm 584.2 x 1014.4 mm |
| B. BASIC MATERIAL |
Thickness capability Special: Thickness capability (incl.HAL) special: |
0.100mm~ 3.200mm 0.050 - 6.40 mm 0.230mm~ 3.230mm 0.075 mm - 6.50 mm |
| C. DRILLING | Maximum drill size Minimum mech. drill size Minimum Laser drill size Hole size tolerance Hole position tolerance |
6.500 mm 0.150mm 0.100mm ± 0.025 mm ± 0.050 mm |
| D. DRY FILM |
Minimum line width (1/2 oz base copper) Special: Minimum line width (1 oz base copper) Special: Minimum spacing (Line to line, 1/2 oz base copper) Special: Minimum spacing (Line to line, 1 oz base copper) Special: Minimum spacing (Pad to pad , 1/2 oz base copper) Minimum spacing (Pad to pad, 1 oz base copper) Minimum spacing (line to pad) Minimum bonding lead width (1/2 oz base copper) Minimum bonding lead width (1 oz base copper) |
0.100 mm 0.075 mm 0.127 mm 0.100 mm 0.100 mm 0.075 mm 0.127 mm 0.100 mm 0.100 mm 0.127 mm 0.100 mm 0.120 mm 0.150 mm 0.100 mm 0.100 mm |
| E. PLATING | Minimum spacing between bonding lead Minimum annular ring Front/Back alignment Minimum spacing between line to NPTH hole |
± 0.050 mm 20 µm 0.200 mm 20 µm 2.500~5 µm 0.0076 µm~ 0.2286 µm ± 0.076 mm |
| F. ETCHING | Finished line width deviation (1 oz base copper HAL board) Finished spacing deviation (1 oz base copper HAL board) Total under cut (1/2 oz base copper) Total under cut (1 oz base copper) |
± 10% ± 20% track width–10% track width–20% |
| G. SOLDER MASK |
Minimum solder mask clearance Minimum solder mask line coverage Minimum solder mask bridge Registration of solder mask The color of Solder mask Brand name |
0.050 mm 0.075 mm 0.100 mm +/-0.075mm green, red, yellow, white, blue, black, and grey Taiyo, Tamura,etc. Full list upon request |
| H. LEGEND | Minimum marking width Minimum marking to hole spacing (Marking in hole is not allowed) Minimum marking to pad spacing (Marking on |
0.150 mm 0.200 mm 0.200 mm |
| I. CARBON INK |
Minimum spacing between two carbon line Minimum carbon line width |
0.200 mm 0.200 mm |
| J. 2ND DRILL | True position tolerance | ± 0.076 mm |
| K. ROUTING | Outline dimension tolerance Outline to drill hole position tolerance Outline to conductor position tolerance Minimum outline to conductor Minimum outline to drill hole spacing |
± 0.100 mm ± 0.050 mm ± 0.050 mm 0.100 mm 0.100 mm |
| L. PUNCHING | Outline dimension tolerance Outline to drill hole position tolerance Outline to punch hole position tolerance Outline to conductor position tolerance Minimum outline to conductor spacing Minimum outline to hole spacing Punch hole true position tolerance Punch hole size tolerance Minimum punch hole size |
± 0.100 mm ± 0.05 mm ± 0.050 mm ± 0.050 mm 0.200 mm same as PCB thickness ± 0.100 mm +0.050/ -0.100 mm ±0.100 mm |
| M. V-CUT | Front/Back alignment tolerance Minimum spacing between V-score and conductor Remained thickness tolerance V-score to V-score tolerance V-score to outline tolerance V-score angle tolerance Possible v-cut angles |
±0.100 mm 0.200 mm ± 0.050 mm ± 0.100 mm ± 0.100 mm ±3° 30, 45 degree |
| N. CHAMFER | Chamfer depth tolerance Chamfer remained thickness tolerance |
±0.100 mm ±0.100 mm |
| O. OTHER | Layer count Aspect ratio HDI/Micro via Warp & Twist Impedance control Min SMT Pitch Peelable Mask Thermal Stress Soldermask Abrasion Test Voltage Current Breakdown Peel Strength |
1-30 layers 10:1 Yes(1+n+1;1+1+n+1+1) <=0.7% Normal: ±10% ( min 50 ohm ); Advance: +/-5% 0.400mm center to center Peters 2955,etc 3x10Sec@288 >6H 50V - 300V 10A 1.4N /mm |