OFFSHORE PCB SOLUTIONS

PCB Capabilities

You can see here our General manufacturing capability for single, double sided and multilayer printed circuit boards. Where tighter tolerances are required from your side, please contact us, and we will for sure find a good solution for your requirement.
Phone: CHINA - CARL: +86 136 99888802, US - RON: 256 883 4400
Email: US: sales@agssales.com, China: sales@ags-china.com

Technical Capabilities

You can see here our General manufacturing capability for single, double sided and multilayer printed circuit boards.  Where tighter tolerances are required from your side, please contact us, and we will for sure find a good solution for your requirement.
All AGS’s manufacturers are UL, ISO9002, QS9000, and ISO14000 approved. AGS also has TS16949 certified suppliers. All AGS’s products are ROHS
PCB components

 PRINTED CIRCUIT BOARD CAPABILITIES

A. BOARD / LAMINATION
B. BASIC MATERIAL
C. DRILLING
D. DRY FILM
E. PLATING
F. ETCHING
G. SOLDERMASK
H. LEGEND
I. CARBON INK
J. 2ND DRILL
K. ROUTING
L. PUNCHING
M. V-CUT
N. CHAMFER
O. OTHER
 
PROCESS DATA  
A. BOARD /
LAMINATION
Multi-layer alignment precision

Minimum laminated Board thickness
Special:

Board dimension max:
Special - up to:
± 0.050mm

0.200 mm
0.075 mm

490 x 590 mm
584.2 x 1014.4 mm
B. BASIC
MATERIAL
Thickness capability
Special:

Thickness capability (incl.HAL)
special:
0.100mm~ 3.200mm
0.050 - 6.40 mm

0.230mm~ 3.230mm
0.075 mm - 6.50 mm
C. DRILLING Maximum drill size
Minimum mech. drill size
Minimum Laser drill size
Hole size tolerance
Hole position tolerance
6.500 mm
0.150mm
0.100mm
± 0.025 mm
± 0.050 mm
D. DRY FILM
Minimum line width (1/2 oz base copper)
Special:

Minimum line width (1 oz base copper)
Special:

Minimum spacing (Line to line, 1/2 oz base copper)
Special:

Minimum spacing (Line to line, 1 oz base copper)
Special:

Minimum spacing
(Pad to pad , 1/2 oz base copper)

Minimum spacing
(Pad to pad, 1 oz base copper)

Minimum spacing (line to pad)

Minimum bonding lead width
(1/2 oz base copper)

Minimum bonding lead width
(1 oz base copper)
0.100 mm
0.075 mm

0.127 mm
0.100 mm

0.100 mm
0.075 mm

0.127 mm
0.100 mm

0.100 mm

0.127 mm

0.100 mm

0.120 mm

0.150 mm

0.100 mm

0.100 mm
E. PLATING Minimum spacing between bonding lead




Minimum annular ring

Front/Back alignment

Minimum spacing between line to NPTH hole
± 0.050 mm
20 µm
0.200 mm
20 µm

2.500~5 µm

0.0076 µm~ 0.2286 µm

± 0.076 mm
F. ETCHING Finished line width deviation
(1 oz base copper HAL board)

Finished spacing deviation
(1 oz base copper HAL board)

Total under cut  (1/2 oz base copper)

Total under cut  (1 oz base copper)
± 10%


± 20%


track width–10%

track width–20%
G. SOLDER
MASK
Minimum solder mask clearance

Minimum solder mask line coverage

Minimum solder mask bridge

Registration of solder mask

The color of Solder mask

Brand name
0.050 mm

0.075 mm

0.100 mm

+/-0.075mm

green, red, yellow, white, blue, black, and grey

Taiyo, Tamura,etc. Full list upon request
H. LEGEND Minimum marking width

Minimum marking to hole spacing (Marking in
hole is not allowed)

Minimum marking to pad spacing (Marking on
0.150 mm  

0.200 mm
 

0.200 mm
I. CARBON
INK
Minimum spacing between two carbon line

Minimum carbon line width
0.200 mm  

0.200 mm 
J. 2ND DRILL True position tolerance ± 0.076 mm 
K. ROUTING Outline dimension tolerance

Outline to drill hole position tolerance

Outline to conductor position tolerance

Minimum outline to conductor

Minimum outline to drill hole spacing
± 0.100 mm  

± 0.050 mm

± 0.050 mm

0.100 mm

0.100 mm
L. PUNCHING Outline dimension tolerance

Outline to drill hole position tolerance

Outline to punch hole position tolerance

Outline to conductor position tolerance

Minimum outline to conductor spacing

Minimum outline to hole spacing

Punch hole true position tolerance

Punch hole size tolerance

Minimum punch hole size
± 0.100 mm  

± 0.05 mm

± 0.050 mm

± 0.050 mm

0.200 mm

same as PCB thickness

± 0.100 mm

+0.050/ -0.100 mm

±0.100 mm  
M. V-CUT Front/Back alignment tolerance

Minimum spacing between V-score and
conductor

Remained thickness tolerance

V-score to V-score tolerance

V-score to outline tolerance

V-score angle tolerance

Possible v-cut angles
±0.100 mm  

0.200 mm


± 0.050 mm

± 0.100 mm

± 0.100 mm

±3°

30, 45 degree
N. CHAMFER Chamfer depth tolerance

Chamfer remained thickness tolerance
±0.100 mm  

±0.100 mm
O. OTHER Layer count

Aspect ratio

HDI/Micro via

Warp & Twist

Impedance control


Min SMT Pitch

Peelable Mask

Thermal Stress

Soldermask Abrasion

Test Voltage

Current Breakdown

Peel Strength
1-30 layers  

10:1

Yes(1+n+1;1+1+n+1+1)

<=0.7%

Normal: ±10% ( min 50 ohm );
Advance: +/-5%

0.400mm center to center

Peters 2955,etc

3x10Sec@288

>6H

50V - 300V

10A

1.4N /mm